Construction & Cooling Design
A copper microchannel cold plate connects to a black-finished aluminium radiator through flexible tubing. Pump and fan layouts vary with the server height. Select the assembly using both chassis clearance and the processor mounting interface.
Technical Specifications
Values below describe the available configuration. Final dimensions and operating conditions are defined in the approved drawing and order specification.
| Configuration | Listed TDP | Listed dimensions | Fan count |
|---|---|---|---|
| 1U | 300 W / 500 W | 395 × 60 × 40 mm | 8 |
| 2U | 500 W | 360 × 50 × 82 mm or 392 × 50 × 82 mm | 4 |
| 4U | 500 W | 396 × 27 × 120 mm | 3 |
Server Integration
Confirm processor socket, mounting pattern and chassis revision when selecting a configuration. Share hose routing and radiator clearance with your enquiry. Listed TDP values apply to the specified assembly; the complete installation also depends on inlet temperature and airflow.
Product Views
Applications
- Rack servers
- AI and HPC equipment
- Enterprise computing
- Edge computing
Configure Your Cold Plate
Send SUNENG your installation drawing or a marked-up sketch, quantity and delivery destination. Identify the component contact areas, port locations, mounting holes and dimensions that must remain fixed.
For thermal selection, include heat load, coolant composition, inlet temperature, available flow and allowable pressure drop. Specify any inspection records needed for sample acceptance. Use the enquiry form below or the full enquiry page to discuss drawings and project requirements.
Ordering Questions
What is needed to confirm fit?
Provide the equipment model and revision together with a mounting drawing. We will use these to define the configuration for quotation.
Can the connections be changed?
Include the required thread or coupling, hose routing and available installation space in your enquiry so they can be reviewed with the plate design.
