Copper-aluminium metallurgical bonding

Compare the new metallurgical bonding process with the traditional brazing process using real terminal samples. The photographs show sample appearance and finish; electrical and mechanical performance must be assessed against the applicable test results.

Preview of SUNENG's copper-aluminium terminal introduction video — Copper-aluminium terminal introductionWatch on YouTube

SUNENG Cu-Al terminal joint detail comparison showing metallurgical bonding and a previous process sample — **Cu-Al terminal joint detail**SUNENG metallurgical bonding and a previous process sample, with SYG-150 and SYG-240 references.

Terminal sample lineup with exposed copper contact faces, marked SYG-150 and SYG-240 samples, and a rough-finish traditional sample — **Terminal sample lineup**Different sample finishes and marked SYG-150 / SYG-240 terminals. Appearance alone does not identify the process of every sample.

Additional sample photographs

SYG-240 samples: metallurgical bonding on the left and traditional brazing on the right — SYG-240 original sample comparison.

Second view of the new and traditional SYG-240 terminal samples — SYG-240 comparison, second view.

Additional view of the terminal sample lineup — Terminal sample lineup, additional view.

Sample comparison video

View the supplied footage alongside the photographs to inspect sample surfaces and geometry.

The SYG in-house test records are separate supporting documents, not a controlled comparison of these two processes.

Discuss a copper-aluminium terminal requirement